ASSEMBLY CONSIDERATIONS FOR LINEAR TECHNOLOGY MMODULE TM BGA

Assembly Considerations For Linear Technology MModule TM BGA

  • Book type: PDF
  • Book size: n/a
  • Book Name: l2-bga-assy-09-27-2016.pdf
  • Source: www.analog.com

assembly considerations for linear technology mmodule tm bga. moisture sensitivity, pack, ship & bake • mmodule products meet msl level 3 or level 4 of the jedec specification j-std-020d.1 march 2008 (please check the label on
Moisture Sensitivity, Pack, Ship & Bake • mModule products meet MSL level 3 or level 4 of the JEDEC specification J-STD-020D.1 March 2008 (Please check the label on

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