Assembly Considerations For Linear Technology MModule TM BGA
- Book type: PDF
- Book size: n/a
- Book Name: l2-bga-assy-09-27-2016.pdf
- Source: www.analog.com
assembly considerations for linear technology mmodule tm bga. moisture sensitivity, pack, ship & bake • mmodule products meet msl level 3 or level 4 of the jedec specification j-std-020d.1 march 2008 (please check the label on
Moisture Sensitivity, Pack, Ship & Bake • mModule products meet MSL level 3 or level 4 of the JEDEC specification J-STD-020D.1 March 2008 (Please check the label on
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